Modul’Up T.E.: the adhesive free damp subfloor solution from Forbo

Modul’Up T.E.: the adhesive free damp subfloor solution from Forbo

Product News

The problem of damp subfloors is a general issue in the market, yet the current flooring solutions available result in a long, complex and costly installation process. However, Forbo Flooring Systems has launched a new easy, economic and hassle-free solution which can be installed directly onto damp subfloors: Modul’Up T.E.  

Forbo launched its adhesive-free sheet vinyl collection Modul’up in 2018, but has since been continuing to develop a version suitable for installation over damp subfloors with up to 97% RH.

The result is Modul’Up T.E., which delivers all the benefits of the Modul’up Compact range, but with the advantage of Forbo’s Aqua Block embossed layer, which allows a direct loose lay installation on damp subfloors. The Aqua Block layer enables the subfloor to breathe and directs the moisture to the periphery of the room, rather than up through the floor covering itself, which can cause damage.  

Garry Bateman, Head of Technical Sales at Forbo Flooring Systems, commented: “To ensure that moisture is dissipated correctly in a room we have also designed an easy to fit breathable skirting for use with the new range.

“As there are no adhesives required to install Modul’Up T.E., downtime is reduced significantly and the floor is ready for use as soon as it has been installed, meaning jobs can be signed off quicker by clients.

“In fact, the total time required for a 100m2 installation, including the waiting time before furniture can be placed back on the floor, is one day for Modul’Up T.E., compared to other existing solutions available on the market which can take several days.”

In addition to its installation benefits, the range is also available in a choice of six contemporary designs, with either a wood or mineral embossed finish, to satisfy all interior design requirements.

For more information please visit www.forbo-flooring.co.uk/modulup